专利类型发明专利 |
申请类型暂无 |
申请方名称Albrecht Jander , Brian P Downey , D Scott Katzer , Vikrant J Gokhale , Shawn C Mack , Pallavi Dhagat , David J Meyer |
发明人暂无 |
申请号US18315560 |
公开号US20230387877A1 |
国际申请暂无 |
申请日2023-05-11 00:00:00 |
主分类号H03H3/02 |
代理机构暂无 |
代理人暂无 |
公开日2023-11-30 00:00:00 |
优先权US63344084 |
进入国家日暂无 |
国际公布日暂无 |
国际申请日暂无 |
地址Arlington VA US |
检索词暂无 |
1. A method for fabricating an integrated acoustic device on an arbitrary functional substrate, comprising : epitaxially growing a sacrificial layer on a host substrate; epitaxially growing a piezoelectric transducer on the sacrificial layer; forming at least one top metal electrode on a top surface of the piezoelectric transducer; etching the sacrificial layer to release the piezoelectric transducer and removing the piezoelectric transducer from the host substrate while maintaining its epitaxial nature and materials properties; and transferring the released piezoelectric transducer to the arbitrary functional substrate; wherein the physical phenomena from the piezoelectric transducer and the arbitrary functional substrate interact to form a hybrid acoustic microsystem comprising the piezoelectric transducer and the arbitrary functional substrate; wherein the arbitrary functional substrate provides critical functionality to the acoustic microsystem.

